Shuttle SZ270R8

Hace mucho que no analizamos un Mini-PC de Shuttle y ha llegado el momento para ver cómo han evolucionado estos equipos desde nuestro último review del modelo SH67H3, hace ya más de 6 años. El formato se mantiene, pero Shuttle ha mejorado/cambiado pequeñas partes de su archifamoso diseño. Este modelo cuenta con el chipset Z270, tecnología Optane, Dual Gigabit y almacenamiento para 4 discos duros de 3,5". Veremos cómo ha sido la evolución y que nos puede ofrecer el último Mini-PC de Shuttle.

A continuación, describimos todas las características del equipo:

•   Chassis
• Black aluminium chassis
• Front panel: brushed aluminium
• Front doors for USB ports
• Kensington Security Slot at the back panel (also called K-Slot
• or Kensington lock) as a part of an anti-theft system
• Dimensions: 34.84 x 21.54 x 19.02 cm (LWH), rubber feet: 7 mm
• Volume: ca. 14.3-litre
• Weight: 3.5 kg net / 5.0 kg gross
•   Storage bays
• Storage bays: 4x 3.5" (internal)
• Using the optional accessory PHD3 two 2.5" drives
• can be installed into one 3.5" bay.
•   Mainboard / Chipset
• Shuttle Mainboard "FZ270", Shuttle Form Factor
• proprietary design for XPC cube Barebone SZ270R8
• Dimensions: 270 x 195 mm
• Chipset: Intel® Z270 Chipset, code name "Union Point"
• Platform Controller Hub (PCH) as Single-Chip-Solution
• Solid Capacitors for sensitive areas provide excellent
• heat resistance for enhanced system durability
•   BIOS
• AMI BIOS, SPI Interface, 32 MBit Flash-ROM with SPI interface
• Supports PnP, ACPI 3.0, Hardware Monitoring
• Supports Unified Extensible Firmware Interface (UEFI)
• Supports boot-up from external USB flash memory
•   Power supply
• Built-in 500 Watt mini switching power supply (PC63J)
• AC input voltage: supports 100~240 V, 50~60 Hz
• 80 PLUS Silver [9] compliant: the PSU provides at least 
• 85/89/85% of efficiency at 20/50/100% of load.
• Active PFC circuit (Power Factor Correction)
• ATX main power connectors: 2x10 and 2x2 pins
• Graphics power connector: 6 pins and 8 pins
• Other connectors: 4x SATA, 2x Molex, 1x Floppy
•   Operation System
• This system comes without operating system.
• It is compatible with Windows 7 / 10 and Linux (64-bit).
• Note: Windows 7 is only supported in combination with 6th generation Intel Core processors "Skylake".
• Additional note on Windows 7 see [7]
•   Processor support
• Socket LGA 1151 (H4) supports
• Intel Core i7 / i5 / i3, Pentium and Celeron processors
• - 6th generation, code name "Skylake"
• - 7th generation, code name "Kaby Lake"
• Maximum supported processor power consumption (TDP) = 95W
• 14nm process technology, up to 8 MB of L3 cache
• Not compatible with Intel Xeon E3 V5 processors for socket LGA 1151 and processors with the older Socket LGA 1150.
• Supports the unlock-function of Intel K-Series processors.
• The processor integrates PCI-Express, memory controller
• and the graphics engine on the same die (performance features 
• depending on processor type)
• Please refer to the support list for detailed processor support information at global.shuttle.com.
•   Processor cooling
• Shuttle I.C.E. (Integrated Cooling Engine)
• Advanced I.C.E. Heatpipe technology with 3 pipes
• Temperature controlled 92 mm fan
• SilentX cooling and noise reduction technology with Active Airflow
•   Memory support
• 4 x 288-pin slot
• Supports DDR4-2133/2400 memory (PC4-17066/19200) at 1.2V
• Supports 2+2 Dual Channel mode
• Supports max. 16 GB per DIMM, maximum total size of 64 GB
•   Integrated Graphics
• The features of the integrated Intel HD graphics function 
• depend on the processor type used.
• Supports DirectX 12, OGL 5.x, OCL 2.x
• The PC features three digital video outputs:
• - HDMI v1.4b (supports 1080p/60 and 2160p/30)
• - 2x DisplayPort v1.2 (support 1080p/60 and 2160p/60)
• Supports displays with 4K Ultra HD resolution at 3840 x 2160 [3]
• Supports three independent FullHD displays with the integrated graphics function
• Supports more displays in combination with a discrete graphics card [2]
• Supports Blu-ray (BD) playback with HDCP copy protection
• Supports multi-channel digital audio over the same cable
• Maximum shared memory of 512 MB
•   PCIe Expansion Slots
• 1x PCI-Express x16 v3.0 slot (PEG, for graphics cards only)
• 1x PCI-Express x4 v3.0 slot
• This XPC supports dual-slot (double-width) graphics cards -
• in this case the second PCI-Express slot will be occupied.
• The length of the graphics cards can be up to 280 mm
• or 273 mm, if the power connectors are on the back side.
• Graphics power connectors: 6-pin and 8-pin
•   Two M.2-2280 SSD slots
• The mainboard provides two M.2 2280 slots with the following interfaces:
• - PCI-Express Gen. 3.0 X4 (max. 32 Gbps), supports NVMe
• - SATA v3.0 (max. 6 Gbps)
• It supports M.2 cards with a width of 22 mm
• and a length of 42, 60 or 80 mm (type 2242, 2260, 2280).
• Supports M.2 SSDs with SATA or PCI-Express interface.
•   Intel® Optane™ Ready
• The SZ270R8 supports the Intel® Optane™ Technology
• which accelerates the speed of one hard disk through data caching.
• This requires a 7th gen. Intel Core processor ("Kaby Lake") 
• and an Optane-SSD with 3D-Xpoint memory (e.g. in M.2 format).
•   M.2-2230 slot for WLAN cards
• Interfaces: PCI-Express Gen. 2.0 X1 and USB 2.0
• Supports M.2 cards with a width of 22 mm and a length of 30 mm (type 2230)
• Supports WLAN extension cards (optional Shuttle accessory WLN-M [6])
•   Multi-Channel HD audio
• High Definition Audio with Realtek ALC662 codec
• Back panel: three analog audio connectors (3.5 mm):
• Line-in (blue), line-out (green) and microphone input (pink)
• shared with 5.1 channel line-out (front, rear, center/bass)
• Front panel: microphone input and headphones output
• 7.1 channel Digital Audio: via HDMI and DisplayPort outputs
•   Dual Gigabit Network
• Dual network with two RJ45 ports
• 2x Intel i211 Ethernet Controller with MAC, PHY and PCIe interface
• Supports 10 / 100 / 1.000 MBit/s operation
• Supports WAKE ON LAN (WOL)
• Supports network boot by Preboot eXecution Environment (PXE)
• Supports Teaming mode [8]
•   SATA connectors
• The mainboard provides five Serial-ATA 3.0 interfaces, max. 6 Gbps supported
• 4x Serial ATA connector onboard
• Supports Intel Rapid Storage Technology (RST, Raid 0/1/5/10, JBOD)
•   Front Panel Connectors and Buttons
• Microphone input
• Headphones output (line-out)
• 2x USB 3.0
• Power button
• Power indicator (blue LED)
• Hard disk drive indicator (yellow LED)
•   Back Panel Connectors
• 1x HDMI v1.4b
• 2x DisplayPort v1.2 [4]
• 4x USB 3.0
• 4x USB 2.0
• 2x Gigabit LAN (RJ45)
• 3x Audio 3.5 mm (Line-in, Line-out, Microphone-in)
• Clear CMOS button
• Optional: serial port RS-232 (Accessory: H-RS232)
• 3x perforation for optional WLAN antennas (Accessory: WLN-M)
•   Other Onboard Connectors
• 2x USB 2.0 (2x 5-pin)
• 1x RS232 (2x 5-pin) for optional accessory H-RS232
• 2x fan connectors (4 pin), both connectors are occupied
• Occupied front connectors: USB 3.0, USB2.0, audio, power buttons, LEDs
•   Included Accessories
• Multi-language XPC Installation Guide (EN, DE, FR, ES, JP, KR, SC, TC)
• 32/64 bit driver disk for Windows
• 4x Serial ATA cables
• AC Power Cord (with protective-earth contacts)
• Heatsink Compound
• Protector cap for the CPU socket (do not use if heat-pipe or fan is mounted)
• Bag with screws
•   Optional Accessories
• PHD3: 3.5" to 2.5" adapter
• H-RS232: Backpanel COM port adapter for RS232 serial interface
• WLN-M: Wireless LAN 802.11ac + BT4.0 module with two external antennas [6]
•   Environmental Spec
• Operating temperature range: 0~40 °C
• Relative humidity range: 10~90% (non-condensing)
•   Certifications and Compliance
• EMI: FCC, CE, BSMI, C-Tick
• Safety: ETL, CB, BSMI
• Other: RoHS, Energy Star 5.0, ErP
•   Conformity
• This device is classed as a technical information equipment (ITE) in class B and is intended for use in living room and office. The CE-mark approves the conformity by the EU directives:
• (1) 2004/108/EC relating to electromagnetic compatibility (EMC),
• (2) 2006/95/EC relating to Electrical Equipment designed for use within certain voltage limits (LVD),
• (3) 2009/125/EC relating to ecodesign requirements for energy-related products (ErP)